A Design is only a Beginning

Last Updated on Thursday, 07 June 2012 09:45

eXception’s advanced Engineering Skills and Processes maximise PCB performance

As the complexity of PCB designs increase, the number of Manufacturers able to deliver optimal PCB decreases. eXception’s record of continuous investment in Technology and Engineering skills makes us a leading player in the advanced HDI market, where companies require smaller, quicker and less bulky products with enhanced functionality. Access to laser direct imaging to allow true-definition of fine traces and spaces and registration of solder mask is a pre-requisite as providing sub-50 microns become an industry standard. Defined registration techniques also enable connection to connection, pad to pad and layer to layer interconnectivity, essential building blocks to providing reliable multilayer sequential solutions. To achieve challenging sub- 50 micron vias, advanced laser drilling technology is used for very accurate drilling through multiple dielectric and laminate material, including FR4, HiTG FR4, BT epoxys and ceramics

Over the last few years, the benefits of micro-via technology have become clear to the Industry, enabling increased routing density thus reducing the amount of layers required to complete the PCB design. CSP (chip scale package) devices are now becoming cheaper than their through-hole counterparts – so although a bare PCB may be slightly more expensive, measurable cost savings are realised at the assembly stage, especially with the adoption of flatcopper filled SMT pads via our eXFPT® processes

As Customers’ technical requirements have evolved, micro-vias have had to keep pace. Even with standard micro-via usage, devices such as 0.30mm (300 micron) micro BGAs have become almost impossible to “track out” due to the limitations of laser drilling technology. eXception developed a micro-via tower process, eXMVT®, whereby standard micro-vias are placed directly on top of each other, thus reducing diameter, increasing routing density and, due to the via being filled with solid copper, aiding signal integrity and thermal transfer from the outer layers throughout the construction