| HDI (High Density Interconnection) |
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Page 1 of 2 In a market where TTT (time to technology) and TTM (time to market) are the key differentiators amongst OEM's, the need for increase design awareness is a guaranteed pre-requisite with most designs that are adopting the need for miniaturisation, that miniaturisation incurs additional headaches in not only design and fabrication but also during assembly and component placement, often due to components that are leading the way with increased features but on a reduced footprint. As the adoption of micro ball grid arrays (BGAs) and flip chip devices becomes more widespread, the ability to test silicon becomes increasingly difficult using conventional PCB manufacturing techniques. Clearly, a specialist service need to be undertaken as part of the design concept that captures the need for DFM (design for manufacturing and DFV (design for volume) to ensure Exception deliver a yield and cost effective service. Clearly, as the level of complexity rises, so the number of PCB Manufacturing partners able to deliver this type of support diminishes. Investment in technology is a key pre-requisite to playing in the Advanced HDI world. Access to laser direct imaging to allow true-definition of fine traces and spaces and registration of solder mask is vital as the requirements for providing sub-50 microns is becoming an everyday occurrence. Defined registration techniques also enable connection to connection, pad to pad and layer to layer interconnectivity, which is an essential building block to providing reliable multilayer sequential solutions. In order to achieve the elusive sub- 50 micron vias, the latest laser drilling technology is used. This method allows very accurate drilling through multiple dielectric and laminate materials be it FR4, HiTG FR4, BT epoxys or ceramics. |